Sputter system, 1 set | Located at 110, Physics Building

The sputter system contains two chambers, one is main chamber with hot plate (4 inch, up to 500 C), plasma power(<500 W), controllable pressure (1 to 100 mTorr), and two mass flow meters, the other chamber is for loadlocking. It can be used for the coating different metal films, especially single crystalline Cu, Ni films.