全自动磁控溅射系统, 1套 | 位置：物理楼110

The sputter system contains two chambers, one is main chamber with hot plate (4 inch, up to 500 C), plasma power(<500 W), controllable pressure (1 to 100 mTorr), and two mass flow meters, the other chamber is for loadlocking. It can be used for the coating different metal films, especially single crystalline Cu, Ni films.